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Product ID
Product NameBis(ethylenediamine)copper(II) Hydroxide
CAS # 
MDL#MFCD00274628 
Structure
SMILES NCCN.NCCN.[Cu+2].[OH-].[OH-] 
Molecular Formula C4H18N4O2Cu 
Molecular Weight217.76 
Chemical Purity95% 
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